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VERSION:2.0
PRODID:-//6AM City//SJtoday//EN
CALSCALE:GREGORIAN
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BEGIN:VEVENT
UID:evt_1d5HdXpDq3b6-20261112T160000Z@sjtoday.5amcity.com
DTSTAMP:20261105T081801Z
DTSTART:20261112T160000Z
DTEND:20261114T010000Z
SUMMARY:Seventh Annual IEEE Symposium on Reliability for Electronics and Ph
 otonics Packaging (REPP)
LOCATION:UCLA\, Los Angeles\, California\, United States\, Virtual: https:/
 /events.vtools.ieee.org/m/572167
DESCRIPTION:[]This 2-day symposium focuses on quantified reliability\, acce
 lerated testing and probabilistic assessments of the useful lifetime of el
 ectronic\, photonic\, MEMS and MOEMS materials\, assemblies…\n\nhttps://
 ieeesfbac.org/event/seventh-annual-ieee-symposium-on-reliability-for-elect
 ronics-and-photonics-packaging-repp/
URL:https://ieeesfbac.org/event/seventh-annual-ieee-symposium-on-reliabilit
 y-for-electronics-and-photonics-packaging-repp/
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